Punching Dies with Wall 0.2mm

Punching Dies with Wall 0.2mm

Different materials for an optimum performances. Including 1.2343, 1.2516, HSS, CPM10V, ASP23, ASP30 etc..

Specifications

Material Different materials for an optimum performances. Including 1.2343, 1.2516, HSS, CPM10V, ASP23, ASP30 etc.
Process Advanced machining process such as Profile grinding, mirror EDM from MITSUBISHI, Japan. Wire-EDM from Seibu, Japan.
Coating TiN & TiCN etc. coating to be applied according to requests.

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Specifications

SpecificationDetail
MaterialDifferent materials for an optimum performances. Including 1.2343, 1.2516, HSS, CPM10V, ASP23, ASP30 etc.
ProcessAdvanced machining process such as Profile grinding, mirror EDM from MITSUBISHI, Japan. Wire-EDM from Seibu, Japan.
CoatingTiN & TiCN etc. coating to be applied according to requests.

Key Capabilities

  • Precision Manufacturing: Advanced machining process such as Profile grinding, mirror EDM from MITSUBISHI, Japan. Wire-EDM from Seibu, Japan.
  • Surface Treatment: TiN & TiCN etc. coating to be applied according to requests.